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一种基于挤压铝合金液冷板的双边进出液冷系统 Title:ADual-SidedLiquidCoolingSystembasedonExtrudedAluminumAlloyLiquidColdPlate Abstract: Withtheincreasingdemandforefficientheatdissipationinhigh-powerelectronicdevices,liquidcoolingsystemshavegainedsignificantattentionduetotheirsuperiorthermalmanagementcapabilities.Inthisstudy,weproposeanoveldual-sidedliquidcoolingsystembasedonanextrudedaluminumalloyliquidcoldplate.Thesystemisdesignedtoenhanceheattransferefficiency,reducethermalresistance,andmaintainoptimaloperatingtemperaturesinelectronicdevices. 1.Introduction Electronicdevices,suchashigh-performanceCPUs,GPUs,andpowerelectronics,generateasignificantamountofheatduringoperation.Traditionalaircoolingsystemsareofteninsufficienttodissipatethisheat,leadingtoperformancedegradationandreducedlifespan.Liquidcoolingsystems,ontheotherhand,haveshowngreatpotentialinachievinghigherheatdissipationefficiency,thusaddressingthethermalchallengesfacedbytheseelectronicdevices.Inthispaper,wepresentadual-sidedliquidcoolingsystembasedonanextrudedaluminumalloyliquidcoldplate. 2.DesignandFabricationoftheDual-SidedLiquidCoolingSystem Thedual-sidedliquidcoolingsystemconsistsofseveralkeycomponents,includingtheliquidcoldplate,heatexchangers,pump,reservoir,andtubing.Theliquidcoldplateisacrucialcomponentresponsiblefortransferringheatfromtheelectronicdevicetothecoolant.Itisdesignedusingextrudedaluminumalloyduetoitsexcellentthermalconductivityandlightweightproperties.Thefabricationprocessinvolvesextrusion,CNCmachining,andsurfacetreatmenttoachievethedesireddimensionsandsurfacefinish. 3.HeatTransferPerformanceAnalysis Toevaluatetheheattransferperformanceofthedual-sidedliquidcoolingsystem,aseriesofexperimentsareconducted.Thermalresistance,pressuredrop,andoverallheattransfercoefficientaremeasuredunderdifferentoperatingconditions.Theresultsdemonstratethattheliquidcoolingsystemeffectivelyreducesthetemperatureoftheelectronicdeviceandmaintainsastableoperatingtemperature.Theextrudedaluminumalloyliquidcoldplateexhibitsexcellentthermal