IC封装产业介绍及常用封装方式简述(图文版).ppt

现在的世界就是一颗一颗芯片芯片需要封装所以世界正在被一颗一颗的封装封装在IC制造产业链中之位置封装作业之一般流程(QFP为例)封装用原材料以及所需零组件封装用机台以及所涉及模具封装趋势演进图封装类型分类DIP封装之特点
1.适合在PCB(印刷电路板)上穿孔焊接，操作方便。2.芯片面积与封装面积之间的比值较大，故体积也较大。
DIP封装图示
bodythickness：155mil
PKGthickness:350mil
Leadwidth:18.1mil
Leadpitch:100mil
DIP系列封装其他形式
PDIP（PlasticDIP）、CDIP（CeramicDIP）
SPDIP（ShrinkplasticDIP）二、SOP/SOJ小尺寸封装SOP(SmallOut-LinePackage)封装形态之图示bodythickness:87~106milPKGthickness:104~118milLeadwidth:16milLeadpitch:50milSOJ(SmallOut-LineJ-Leadpackage)封装形态之图示bodythickness:100milPKGthickness:130~150milLeadwidth:17~20milLeadpitch:50milSOP封装系列之其他形式
1.SSOP(ShrinkSOP)
bodythickness：70~90mil
PKGthickness:80~110mil
Leadwidth:10~15mil
Leadpitch:25mil
2.TSOP(ThinSOP)
bodythickness：1.0mm
PKGthickness:1.2mm
Leadwidth:0.38~0.52mm
Leadpitch:0.5mm3.TSSOP(ThinShrinkSOP)

bodythickness：0.90mm
PKGthickness:1.0mm
Leadwidth:0.1~0.2mm
Leadpitch:0.4~0.65mm
4.TSOP(Ⅰ):ThinSOPⅠ
5.TSOP(Ⅱ):ThinSOPⅡ
6.QSOP:QuarterSizeOutlinePackage
7.QVSOP:QuarterSizeVerySmallOutlinePackage
三、QFP方型扁平式封装和PFP扁平封装QFP方型扁平式封装和PFP扁平封装图示
bodythickness：>2.8mm
PKGthickness:>3.3mm
Leadwidth:0.18~0.35mm
Leadpitch:0.40~1.0mm

QFP封装系列之其他形式
1.LQFP(LowprofileQFP)：
bodythickness：1.4mm
PKGthickness:1.6mm
Leadwidth:0.22~0.37mm
Leadpitch:0.40~0.80mm
2.TQFP(ThinQFP):
bodythickness：1.0mm
PKGthickness:1.2mm
Leadwidth:0.18~0.37mm
Leadpitch:0.40~0.80mm

3.DPH-QFP(DiePadHeatSinkQFP)
bodythickness：2.8mm
PKGthickness:3.3mm
Leadwidth:0.2~0.3mm
Leadpitch:0.5mm4.DPH-LQFP(Die-padHeatSinkLow-profileQFP)
bodythickness：1.4mm
PKGthickness:1.6mm
Leadwidth:0.22mm
Leadpitch:0.5mm

5.DHS-QFP(Drop-inHeatsinkQFP)
bodythickness：1.4mm
PKGthickness:1.6mm
Leadwidth:0.22mm
Leadpitch:0.5mm

6.EDHS-QFP(ExposedDrop-inHeatsinkQFP)
bodythickness：>3.2mm
PKGthickness:>3.6mm
Leadwidth:0.18~0.3mm
Leadpitch:0.4~0.65mm

7.E-PadTQFP(Exposed-PadTQFP)
bodythickness：1.0mm
PKGthickness:1.2mm
Leadwidth:0.22mm
Leadpitch:0.50mm8.VFPQFP(VeryFinePitchQFP)
9.S2QFP(SpacerStackedQFP)
11.StackedE-PADLQFP10.MCM-LQFP(Multi-chipmoduleLow-profileQFP)
12.PLCC(PlasticLead