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IC封装(图文对照).pdf

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芯片封装方式大全 各种ICICIC封装形式图片 QFP QuadFlat BGA Package BallGridArray TQFP100L EBGA680L SBGA LBGA160LSC-705L PBGA217L PlasticBallGrid ArraySDIP SIP SBGA192LSingleInline Package SO Small Outline Package TSBGA680L SOJ32L CLCC SOJ CNRSOPEIAJ CommunicationTYPEII14L andNetworking Riser Specification Revision1.2SOT220 SSOP16L CPGA CeramicPinGrid Array DIP DualInline SSOP Package TO18 DIP-tab DualInline TO220 Packagewith MetalHeatsink FBGA TO247 FDIP TO264 FTO220 TO3 FlatPack TO5 HSOP28 TO52 ITO220 TO71 TO72 ITO3p TO78 JLCC LCC TO8 LDCC TO92 LGA TO93 LQFP TO99 PCDIP TSOP ThinSmall PGA Outline PlasticPinGrid Package Array TSSOPor TSOPII Thin PLCC Shrink Outline 详细规格 Package uBGA PQFP MicroBall GridArray PSDIP uBGA MicroBall GridArray LQFP100L 详细规格 METALQUAD 100L ZIP 详细规格Zig-Zag Inline PQFP100L Package 详细规格 TEPBGA288LTEPBGA QFPC-Bend QuadFlatLead Package CERQUAD SOT220Ceramic QuadFlat Pack 详细规格 SOT223 Ceramic Case LAMINATE SOT223 CSP112L ChipScale Package 详细规格 SOT23 GullWing Leads SOT23/SOT323 LLP8La 详细规格 SOT25/SOT353 PCI32bit5V Peripheral SOT26/SOT363 Component Interconnect SOT343详细规格 PCI64bit 3.3V SOT523 PCMCIA SOT89 PDIP SOT89 PLCC 详细规格 Socket603 FosterSIMM30 Single In-line Memory LAMINATE Module TCSP20L ChipScaleSIMM72 PackageSingle In-line Memory Module TO252 SIMM72 Single In-line SLOT1 TO263/TO268Forintel PentiumII PentiumIII SODIMM &Celeron SmallOutline CPU DualIn-line MemoryModuleSLOTA ForAMD SOCKET370 AthlonCPU Forintel370pin PGAPentiumIII &CeleronCPU SNAPTK SOCKET423 Forintel423pin PGAPentium4SNAPTK CPU SOCKET SNAPZP 462/SOCKETA ForPGAAMD Athlon&DuronSOH CPU SOCKET7 ForintelPentium &MMXPentium CPU 各种封封封装装装缩缩缩写写写说说说明明明 BGA BQFP132 BGA BGA BGA BGA BGA CLCC CNR PGA DIP DIP