LED封装结构及其技术.doc

PAGEI本科毕业论文题目：LED封装结构及其技术院（部）：理学院专业：应用物理学班级：光电054姓名：学号：指导教师：完成日期：2009年6月1日山东建筑大学毕业论文PAGEVII目录TOC\o"1-3"\h\z\uHYPERLINK\l"_Toc232431277"摘要······································································PAGEREF_Toc232431278\hIVHYPERLINK\l"_Toc232431278"ABSTRACT·······························································ⅣHYPERLINK\l"_Toc232431279"1前言····································································1HYPERLINK\l"_Toc232431280"1.1关于发展半导体照明的重要性···············································11.2HYPERLINK\l"_Toc232431281"LED的发光原理、特点、分类及应用·········································21.2.1LED的发光原理·································································21.2.2LED光源的基本特征····························································31.2.3LED光源的分类·································································51.2.4LED光源的应用·································································6HYPERLINK\l"_Toc232431282"1.3LED封装的基本问题····················································6HYPERLINK\l"_Toc232431283"2LED封装技术的研究现状·················································8HYPERLINK\l"_Toc232431284"2.1引言·····································································82.2HYPERLINK\l"_Toc232431285"LED封装形式的演变、封装工艺流程、封装材料································82.2.1LED封装形式的演变·····························································82.2.2LED封装工艺流程······························································102.2.3LED封装材料···································································12HYPERLINK\l"_Toc232431286"2.3产品封装结构类型························································13HYPERLINK\l"_Toc232431287"2.3.1引脚式封装·····························································13HYPERLINK\l"_Toc232431288"2.3.2表面贴装封装··························································15HYPERLINK\l"_Toc232431289"2.3.3功率型封装····························································16HYPERLINK\l"_Toc232431290"2.3.4食