预览加载中，请您耐心等待几秒...

COB封装的LED的热应力与应变的模拟仿真与分析.docx

预览
1/2
2/2

在线预览结束，喜欢就下载吧，查找使用更方便

下载提示 文本预览

如果您无法下载资料，请参考说明：

1、部分资料下载需要金币，请确保您的账户上有足够的金币

2、已购买过的文档，再次下载不重复扣费

3、资料包下载后请先用软件解压，在使用对应软件打开

COB封装的LED的热应力与应变的模拟仿真与分析 Title:SimulationandAnalysisofThermalStressandStrainforCOBPackagedLED Abstract: ThispaperpresentsacomprehensivesimulationandanalysisofthermalstressandstrainforChip-on-Board(COB)packagedLightEmittingDiodes(LEDs).TheobjectiveistostudytheeffectsofthermalstressandstrainontheperformanceandreliabilityofCOBpackagedLEDs.AnumericalmodelisdevelopedtosimulatethethermalbehavioroftheLEDpackageunderdifferentoperatingconditions.Thesimulationresultsarethenanalyzedtoassesstheimpactofthermalstressandstrainonthedevice. 1.Introduction: Thegrowingdemandforhigh-performance,energy-efficientlightingsolutionshasledtothewidespreaduseofCOBpackagedLEDs.TheCOBpackageoffersseveraladvantagesovertraditionalLEDpackages,includingimprovedthermalmanagementandhigherluminousefficacy.However,thethermalstressandstraininducedbytemperaturevariationsintheCOBpackagecanaffectthedevice'sperformanceandreliability.Therefore,understandingandanalyzingthethermalbehaviorofCOBpackagedLEDsiscrucialfortheirdesignandoptimization. 2.Methodology: TosimulatethethermalstressandstrainintheCOBpackagedLED,anumericalsimulationmodelisdevelopedusingfiniteelementanalysis(FEA)techniques.Themodelconsiderstheheattransfermechanisms,includingconvectionandradiation,aswellasthematerialpropertiesandgeometricalcharacteristicsoftheLEDpackage.Thesimulationisperformedundervariousoperatingconditions,suchasdifferentappliedcurrentsandambienttemperatures,tocapturethedynamicthermalbehaviorofthedevice. 3.ResultsandDiscussion: ThesimulationresultsprovidevaluableinsightsintothethermalstressandstraindistributionwithintheCOBpackagedLED.Theanalysisrevealsthathigherappliedcurrentsandambienttemperaturesleadtoincreasedthermalstressandstrainlevels.Thelocationsofmaximumstressandstrainareidentified,helpingintheidentificationofpotentialfailurepointsintheLEDpackage.Furthermore,thetemporalvariationofstressandstrainduringthedeviceoperationisanalyzed,highlightingtheimportanceofthermalmanagementinmaintainingthedevice'slongevityandperformance.