预览加载中，请您耐心等待几秒...

关于BGA封装焊点可靠性及疲劳寿命的探讨.docx

预览
1/2
2/2

在线预览结束，喜欢就下载吧，查找使用更方便

下载提示 文本预览

如果您无法下载资料，请参考说明：

1、部分资料下载需要金币，请确保您的账户上有足够的金币

2、已购买过的文档，再次下载不重复扣费

3、资料包下载后请先用软件解压，在使用对应软件打开

关于BGA封装焊点可靠性及疲劳寿命的探讨 Title:ReliabilityandFatigueLifeAnalysisofBGAPackageSolderJoints Abstract: BallGridArray(BGA)packageshavebecomeincreasinglypopularinelectronicmanufacturingduetotheirhighpincountsandcompactsize.ThispaperaimstoexplorethereliabilityandfatiguelifeofBGApackagesolderjoints.ThestudybeginsbyprovidinganoverviewoftheBGApackagetechnologyandthesolderingprocess.Itfurtherdiscussesthefactorsaffectingthequalityofsolderjoints,suchassolderpaste,reflowprofile,andsubstratematerial.ThestudythendelvesintothemechanismsofsolderjointfailuresandexploresthemethodsusedtoassessthereliabilityandfatiguelifeofBGApackagesolderjoints.Finally,thepaperconcludesbyhighlightingtheimportanceofproperdesign,manufacturing,andtestingtechniquestoensurethereliabilityandperformanceofBGApackages. Introduction: Electronicdeviceshavewitnessedsignificantadvancementsovertheyears,resultinginthedemandforsmallerandmoreefficientcomponents.BallGridArray(BGA)packageshavegainedpopularityduetotheirhighpincounts,compactsize,andexcellentelectricalandthermalperformance.However,thereliabilityandfatiguelifeofBGApackagesolderjointsplayacrucialroleindeterminingtheoverallreliabilityofelectronicassemblies.ThispaperaimstoexplorethevariousfactorsaffectingthereliabilityandfatiguelifeofBGApackagesolderjointsandproposesstrategiestoenhancetheirperformance. BGAPackageTechnology: BGApackagesconsistofanarrayofsolderballsarrangedinagridpatternonthebottomsurfaceofthepackage.Thesesolderballsactastheelectricalandmechanicalconnectionpointsbetweenthepackageandtheprintedcircuitboard(PCB).Thepackageitselfcomprisesmultiplelayers,includingthedie,substrate,soldermask,andcoppertraces.Thetechnologyoffersseveraladvantages,suchashigherpincounts,reducedPCBspacerequirements,improvedelectricalperformance,andimprovedthermaldissipation. SolderingProcessandFactorsAffectingSolderJointQuality: ThesolderingprocessforBGApackagesinvolvesdepositingsolderpasteontothePCBpads,placingthepackageontothePCB,andsubjectingittoareflowprocess.Thequalityoftheso