plasma原理演示幻灯片.ppt

等离子技术讲座:等离子原理及其应用PLASMATRAININGPROGRAM目录Agenda等离子技术在高级封装工业的应用PlasmaApplicationinAdvancedPackagingIndustries综述Overview:集成电路封装面临的挑战ICAssemblyandPackaging:SpecificChallenges等离子体应用PlasmaApplications表面活化:芯片粘结SurfaceActivation:DieAttach污染物去除:导线连接ContaminationRemoval:WireBonding污染物去除:导线连接ContaminationRemoval:WireBonding污染物去除和表面活化:封装ContaminationRemovalandSurfaceActivation:EncapsulationDelaminationBiggestChallengeForOrganicBasedSubstratesLaminateMaterialsAbsorbWaterFromAirandtheFluxResidueRemovalProcessTrappedMoistureReleasedFromHighTemperatures:UseorSolderingOxidationonMetalLeadframesCanInhibitAdhesionofFrametoMoldPlasmaTreatmentofBGAPackages,OtherPolymerSubstrates,andMetalLeadframesImprovesSurfaceActivityAchievesGoodAdhesionMinimizesDelamination表面活化:填料SurfaceActivation:UnderfillPresenceofOxidesInhibitsWireBondingLimitsGoodDieAttachmentInhibitsSolderReflowPlasmaTreatmentReducesMetalOxidesImprovesWireBondStrengthImprovesDieAttachmentImprovesSolderReflow印刷线路板上的残余物清除DesmearinginPCB集成电路封装中等离子工艺的应用ICAssemblyandPackaging:PlasmaSolutions等离子工艺的其它应用OtherPlasmaApplications关键参数CriticalProductParameters等离子工艺参数ParametersForPlasmaProcessing等离子技术PlasmaTechnology等离子体简述Plasma:What,Why,How什么是等离子体WhatisaPlasma?固态液态气态等离子态SolidLiquidGasPlasmaEnergyEnergyEnergy等离子体的组成ComponentsofaPlasma等离子体特性PlasmaProperties表面反应机理:物理反应SurfaceReactionMechanisms:Physical表面反应机理:化学反应SurfaceReactionMechanisms:Chemical表面反应总结SummaryofSurfaceReactionMechanisms等离子技术的优点AdvantagesofPlasmaTreatment等离子工艺PlasmaProcess等离子体的产生GeneratingaPlasma等离子体的产生GeneratingaPlasma等离子体的产生GeneratingaPlasma等离子体的重要特性ImportantPropertiesofaPlasma等离子体的电子和离子特性PlasmaElectronandIonProperties等离子体的电子和离子特性PlasmaElectronandIonProperties等离子体的电子和离子特性PlasmaElectronandIonProperties等离子处理模型PlasmaModesDirectPlasma:Argon(Ar)DirectPlasma:Oxygen(O2)Downstream:Ion-FreePlasmaDownstream:Ion-FreePlasma等离子处理模型PlasmaModes成功应用的关键参数CriticalParametersForSuccessfulApplication电源功率及频率PowerSupplyFrequencyandPower为什么选择频率13.56MHz?Frequency:Why13.56MHz?真空腔及电极组合ChamberandEle