基于单片机的多点温度测试系统本科毕设论文.doc

基于单片机的多点温度测试系统摘要集成电路的大规模发展对单片机控制电路的实际运用有着巨大的推动作用。单片机具有体积小、重量轻、价格便宜、低功耗、控制功能强及运算速度快等特点，使其在测控系统、智能仪表、机电一体化产品、智能接口等方面具有较广泛的运用。以单片机为核心，运用温度传感器可完成对温度采集，并进行相应的处理。本系统利用4片温度传感器DS18B20把所测得的温度发送到AT89C52单片机上，通过单片机的处理发送到显示单元进行显示。系统运用单片机进行温度上下限设定，对各点温度进行测控报警，运用主从分布式思想，实现温度的远程控制，构成多点温度检测系统。关键词单片机，温度传感器，多点温度检测ABSTRACTThepracticalapplicationoflarge-scaledevelopmentoftheintegratedcircuitchipcontrolcircuithasatremendousroleinpromoting.MCUwithasmallsize,lightweight,inexpensive,low-power,controlandcomputingspeed,hasawideruseinthemonitoringandcontrolsystems,intelligentinstruments,mechanicalandelectricalintegrationproducts,intelligentinterface.Withthesinglechipprocessorasthecore,theapplicationoftemperaturesensorfortemperatureacquisitioncanbecompleted,andcarryoncorrespondingprocessing.Thissystem,usingfourslicesofDS18B20,sentthetemperaturemeasuredbythetemperaturesensorDS18B20toAT89C52single-chipcomputer,throughtheMCUprocessing,thetemperatureissenttothedisplayunittodisplay.ThesystemusestheMCUtosetupperandlowertemperature,tomeasureandcontrolthepointtemperatureandalarm.Atthesametime,usethemaindistributedthoughttoachieveremotecontrolofthetemperature,andtoconstituteamulti-pointtemperaturedetectionsystem.KeyWords:MCU,Slice,Multi-pointtemperaturedetection目录TOC\o"1-3"\h\z\uHYPERLINK\l"_Toc355768300"1.绪论PAGEREF_Toc355768300\h1HYPERLINK\l"_Toc355768301"1.1课题背景PAGEREF_Toc355768301\h1HYPERLINK\l"_Toc355768302"1.2国内外发展现状PAGEREF_Toc355768302\h1HYPERLINK\l"_Toc355768303"1.3本设计的内容及任务PAGEREF_Toc355768303\h2HYPERLINK\l"_Toc355768304"1.3.1设计内容PAGEREF_Toc355768304\h2HYPERLINK\l"_Toc355768305"1.3.2设计任务PAGEREF_Toc355768305\h2HYPERLINK\l"_Toc355768306"2.系统总体设计PAGEREF_Toc355768306\h3HYPERLINK\l"_Toc355768307"2.1系统概述PAGEREF_Toc355768307\h3HYPERLINK\l"_Toc355768308"2.2系统工作原理PAGEREF_Toc355768308\h3HYPERLINK\l"_Toc355768309"2.3系统器件的选择PAGEREF_Toc355768309\h4HYPERLINK\l"_Toc355768310"2.3.1单片机的选择PAGEREF_Toc355768310\h4HYPERLINK\l"_Toc355768311"