印刷电路板PCB的制程.pdf

印刷电路板制造流程电子事业部培训参考资料之九电子事业部培训参考资料之九PCB制造流程顧客(CUSTOMER)磁片磁帶(DISKM/T)業務(SALESDEPARTMENT)圖面(DRAWING)底片(MASTERA/W)工作底片(WORKINGA/W)網版製作(STENCIL)工程製前(FRONT-ENDDEP.)資料傳送(MODEMFTP)程式帶(PROGRAM)鑽孔成型機(D.N.C.)藍圖(DRAWING)生產管理(P&MCONTROL)製作規範(RUNCARD)裁板(LAMINATESHEAR)MLBDOUBLESIDE內層乾膜(INNERLAYERIMAGE)曝光(EXPOSURE)壓膜(LAMINATION)前處理(PRELIMINARYTREATMENT)蝕銅(I/LETCHING)去膜(STRIPPING)蝕銅(ETCHING)顯影(DEVELOPIG)多層板內層流程(INNERLAYERPRODUCT)AOI檢查(AOIINSPECTION)預疊板及疊板(LAY-UP)預疊板及疊板(LAY-UP)烘烤(BAKING)黑化處理(BLACKOXIDE)壓合(LAMINATION)後處理(POSTTREATMENT)壓合(LAMINATION)BlindedVia雷射鑽孔(LASERABLATION)鑽孔(PTHDRILLING)通孔電鍍(P.T.H.)通孔電鍍(E-LESSCU)除膠渣(DESMER)前處理(PRELIMINARYTREATMENT)全板電鍍(PANELPLATING)外層製作(OUTER-LAYER)