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热循环条件下SnAgCu钎料损伤行为的研究(英文).docx

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热循环条件下SnAgCu钎料损伤行为的研究(英文) ResearchonDamageBehaviorofSnAgCuSolderJointsunderThermalCyclingConditions Abstract: Withtheincreasingdemandformicroelectronicdeviceswithsmallersizesandhigherperformance,thereliabilityofsolderjointshasbecomeacriticalconcern.Inthisstudy,thedamagebehaviorofSnAgCusolderunderthermalcyclingconditionswasinvestigated.Theeffectsoftemperaturecycling,thermalfatigue,andintermetalliccompound(IMC)growthonthemechanicalandelectricalpropertiesofthesolderjointswereevaluated.Theresultsprovidevaluableinsightsintothereliabilityandfailuremechanismsofsolderjointsinmicroelectronicdevices. 1.Introduction: Astheelectronicindustrycontinuestoadvance,thereliabilityofsolderjointsinmicroelectronicdeviceshasbecomeamajorconcern.Thermalcycling,whichoccursduringtheoperationofelectronicdevices,cancausesignificantstressandstrainonsolderjoints,leadingtofatigueandeventuallyfailure.Itisimportanttounderstandthedamagebehaviorofsolderjointsunderthermalcyclingconditionsinordertoimprovethereliabilityandlongevityofmicroelectronicdevices. 2.ExperimentalProcedure: 2.1SamplePreparation: SnAgCusolderjointswerefabricatedusingreflowsolderingtechniques.Thesolderjointswereformedbetweenacoppersubstrateandacomponentwithasimilarcoefficientofthermalexpansion.Thesolderjointswerethensubjectedtothermalcyclingconditions. 2.2ThermalCyclingConditions: Thethermalcyclingconditionsweredesignedtosimulatetheoperatingconditionsofthemicroelectronicdevices.Thesamplesweresubjectedtoaspecifiednumberofthermalcycles,witheachcycleconsistingofahigh-temperaturedwellandalow-temperaturedwell.Thetemperaturerangewaschosentorepresenttheexpectedoperatingconditions. 2.3EvaluationofMechanicalandElectricalProperties: Afterthespecifiednumberofthermalcycles,thesolderjointswereevaluatedfortheirmechanicalandelectricalproperties.Thisincludedathoroughexaminationofthesolderjointmicrostructure,analysisoftheIMCgrowth,andmeasurementofthemechanicalstrengthandelectricalconductivityofthejoints. 3.ResultsandDiscussion: 3.1MicrostructuralAna