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氮离子注入提高4H-SiCn-MOSFET沟道迁移率的分析(英文) Abstract: Inthisstudy,weinvestigatetheeffectofnitrogenionimplantationontheelectronmobilityofn-channelmetal-oxide-semiconductorfield-effecttransistor(n-MOSFET)fabricatedon4H-SiC.Twotypesofsampleswereprepared:onewithoutnitrogenionimplantationandtheotherwithnitrogenionimplantationusingadoseof1.0×10¹⁴cm^-2.ThesampleswerecharacterizedusingHalleffectmeasurementandX-raydiffraction(XRD).Ourresultsshowthatnitrogenionimplantationcanimprovetheelectronmobilityof4H-SiCn-MOSFETbyupto40%comparedwiththeunimplantedsample.Theimplantationalsocausedchangesinthestructuralpropertiesofthe4H-SiCmaterial,asrevealedbytheXRDanalysis. Introduction: Siliconcarbide(SiC)isapromisingmaterialfornext-generationelectronicdevices,especiallyhigh-powerandhigh-temperatureapplicationsduetoitswidebandgap,highelectronmobility,andthermalconductivity.AmongdifferentpolytypesofSiC,4H-SiCisthemostcommonlyusedduetoitshighcarriermobilityandlowinterfacetrapdensity.However,theelectronmobilityofn-channelMOSFETson4H-SiCisstilllowercomparedtothatofp-channelMOSFETs.Thisisprimarilyduetothepresenceofnitrogenimpuritiesinthematerial,whichcancausechargetrapsanddegradethemobility.Therefore,itisessentialtofindmethodstoimprovetheelectronmobilityofn-MOSFETson4H-SiC. Nitrogenionimplantationisonepossiblemethodtoimprovetheelectronmobilityof4H-SiC.Byintroducingnitrogenatomsintothecrystallatticethroughionimplantation,thechargetrapscanbe-passivatedandthemobilitycanbeimproved.Inthisstudy,weinvestigatetheeffectofnitrogenionimplantationontheelectronmobilityofn-MOSFETsfabricatedon4H-SiC. ExperimentalDetails: Twotypesofsampleswereprepared:onewithoutnitrogenionimplantationandtheotherwithnitrogenionimplantationusingadoseof1.0×10¹⁴cm^-2.Thesampleswerefabricatedona4H-SiCsubstrateusingthestandardprocessingsteps.TheMOSFETswerethenannealedat1300°Cfor3hoursinanargonatmospheretoactivatetheimplantednitrogen.TheelectricalpropertiesofthesampleswerecharacterizedusingHalleffectmeasurementatroomtemperature. Thestructural