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MEMS后封装技术.docx

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MEMS后封装技术 Introduction Micro-electromechanicalsystems(MEMS)havebecomeincreasinglyprevalentinawiderangeofapplications,fromautomotivesensorstomedicaldevices.MEMSdevicesoffermanyadvantagesovertraditionalmechanicalsystems,suchastheirsmallsize,lowpowerconsumption,andhighsensitivity.However,MEMSdevicesrequirespecialpackagingtoprotectthemfromenvironmentalfactorssuchashumidity,temperature,andmechanicalshock.ThispaperdiscussesthechallengesandsolutionsassociatedwithMEMSpackaging. MEMSPackagingChallenges MEMSusuallyconsistofatinychipwithmicron-scalefeaturesthataresensitivetobothmechanicalandthermalstress.Forexample,MEMSsensorsareoftenmadeofsilicon,whichisbrittleandpronetodamageifitismechanicallystressed.MEMSmayalsocontaindelicatemicrostructuressuchascantilevers,beams,ormembranesthatarerequiredforthesensors'operation.Thesestructurescanbeeasilydeformedbythermalormechanicalstress. AnotherchallengeassociatedwithMEMSpackagingisthatmanyMEMSdevicesaredesignedtointeractwiththeirenvironmentinaparticularway.Forexample,MEMSsensorsformotiondetectionaredesignedtomeasurechangesinaccelerationorrotation.Thesesensorsaretypicallydesignedtobesensitivetothespecificdirectionofmotion,makingitvitalthattheorientationismaintainedduringthepackagingprocess. MEMSPackagingSolutions SeveralsolutionshavebeendevelopedtoaddressthechallengesofMEMSpackaging.OnecommonsolutionforprotectingMEMSdevicesfromenvironmentalfactorsistoplacethechipsinahermeticallysealedenclosure.HermeticpackagesuseametalorceramiccontainerwithawindowthatallowstheMEMStomeasuretheenvironmentwhileprotectingitfromit.Theenclosureisthensealedusingasolderorweldedseal,andtheinteriorisfilledwithinertgas,preventinganychangesinairpressurefromaffectingtheMEMS. Anotherpackagingsolutionistheuseofpolymerencapsulation,whichcanbeusedtoprotectMEMSfrommechanicalandthermalstress.PolymerencapsulationinvolvescoveringtheMEMSchipinaprotectivematerialthatformsabarrierbetweentheMEMSandtheenvironment.Thismaterialcanbeapolymer,epoxy,orothercompositematerial.Thepolyme