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塑封胶吸湿对器件分层影响的研究(英文).docx

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塑封胶吸湿对器件分层影响的研究(英文) ResearchontheImpactofMoistureAbsorptionofEpoxyResinEncapsulationonDeviceDelamination Introduction: Withtheminiaturizationofelectronicdevices,theencapsulationofsemiconductorcomponentsplaysanimportantroleinensuringthereliabilityofelectronicproducts.Epoxyresinhasbeenwidelyusedasanencapsulationmaterialduetoitsexcellentthermalstability,highmechanicalstrength,andgoodadhesiontovarioussubstrates.However,epoxyresinencapsulantsarealsoknownfortheirmoisturesensitivity,andmoistureabsorptionduringtheencapsulationprocesscanleadtodevicedelamination. MoistureAbsorptionofEpoxyResinEncapsulation: Themoistureabsorptionofepoxyresinencapsulationisanimportantfactorthataffectstheadhesionbetweentheencapsulantandthesubstrate,whichmayresultindevicedelamination.Themoistureabsorptionofepoxyresincanbeattributedtothepresenceofhydrophilicgroupssuchashydroxyl(-OH)andether(-O-)groupsinthemolecularstructure.Theabsorbedmoistureleadstotheweakeningoftheadhesionstrengthbetweenthesubstrateandtheencapsulant,whichresultsintheseparationofthedevicelayers. FactorsAffectingMoistureAbsorption: Therearevariousfactorsthatcanaffectthemoistureabsorptionofepoxyresinencapsulants,suchastemperature,humidity,andthechemicalstructureoftheepoxyresin.Thetemperatureandhumidityconditionsduringtheencapsulationprocesscangreatlyaffectthemoistureabsorptionoftheepoxyresin.Generally,hightemperaturesandhumidconditionscanacceleratethemoistureabsorptionprocess.Watervaporcanalsoreactwiththeepoxyresintoformhydrophiliccompounds,whichcanincreasethepropensityofmoistureabsorption.Thechemicalstructureoftheepoxyresinisanotherimportantfactorthataffectsthemoistureabsorptionproperties.Thepresenceofhydrophilicgroupsandthedegreeofcrosslinkingintheepoxyresinmoleculecaninfluencethemoistureabsorptionpropertiesoftheencapsulant. ImpactofMoistureAbsorptiononDeviceDelamination: Moistureabsorptioncanhaveasignificantimpactondevicedelamination.Whenthemoisturecontentintheepoxyresinencapsulantexceedsacertainlevel,hydrolysisoftheepoxyresinca