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WLCSP30器件SnAgCuFe焊点可靠性研究（英文）.docx

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WLCSP30器件SnAgCuFe焊点可靠性研究（英文） Abstract ThereliabilityofSnAgCuFesolderbumpsonWLCSP30deviceswasstudiedthroughvarioustests.Thetestsincludedthermalcycling,high-temperaturestorage,andmechanicalsheartesting.TheresultsindicatedthattheSnAgCuFesolderbumpsexhibitedgoodmechanical,thermal,andelectricalproperties.Thetestsshowedthattherewerenosignificantdifferencesinthereliabilityofthesolderbumpsbetween0.4mmand0.5mmthicknesses.ThestudyprovidesvaluableinformationfortheselectionanduseofsolderbumpsinWLCSP30devices. Introduction Wafer-levelchip-scalepackaging(WLCSP)hasbecomeincreasinglypopularinmicroelectronics,duetoitssmallformfactor,lowcost,andhighperformance.TheWLCSPpackageisessentiallyabaredieencapsulatedinathinlayeroforganicorinorganicmaterial,withsolderbumpsdepositeddirectlyontothediesurface.Thethicknessandcompositionofthesolderbumpsarecrucialforthereliabilityofthepackage. SnAgCuisacommonlyusedlead-freesoldercompositionforWLCSPpackages,duetoitslowmeltingpointandgoodmechanicalstrength.However,duetothelimitedabilityofSnAgCutopreventtheformationoftinwhiskers,otherelementssuchasFeareoftenaddedtothealloytoimproveitswhiskerresistance.ThisstudyfocusesonSnAgCuFesolderbumpsonWLCSP30devices,andtheirreliabilityundervariousstressconditions. ExperimentalProcedure TheWLCSP30devicesusedinthisstudywereobtainedfromacommercialsupplier.TheSnAgCuFesolderbumpsweredepositedontothepadsofthedevicesusingastencilprintingprocess.Thethicknessofthesolderbumpswasvariedbetween0.4mmand0.5mm. Thereliabilityofthesolderbumpswasevaluatedthroughthermalcycling,high-temperaturestorage,andmechanicalsheartesting.Thethermalcyclingtestinvolvedsubjectingthedevicesto1000cyclesbetween-40°Cand125°Cwithadwelltimeof15minutesateachtemperatureextreme.Thehigh-temperaturestoragetestinvolvedsubjectingthedevicesto500hoursat150°C.Themechanicalsheartestinginvolvedapplyingashearforcetothesolderbumpsuntiltheyfailed. ResultsandDiscussion TheresultsofthethermalcyclingtestshowedthatalldeviceswithSnAgCuFesolderbumpssurvivedthe1000cycleswith