IC芯片封装测试工艺流程ppt课件.ppt

IntroductionofICAssemblyProcessIC封装工艺简介ICProcessFlowICPackage（IC的封装形式）ICPackage（IC的封装形式）ICPackage（IC的封装形式）ICPackage（IC的封装形式）ICPackage（IC的封装形式）ICPackageStructure（IC结构图）RawMaterialinAssembly(封装原材料)RawMaterialinAssembly(封装原材料)RawMaterialinAssembly(封装原材料)RawMaterialinAssembly(封装原材料)RawMaterialinAssembly(封装原材料)TypicalAssemblyProcessFlowFOL–FrontofLine前段工艺FOL–BackGrinding背面减薄FOL–WaferSaw晶圆切割FOL–WaferSaw晶圆切割FOL–2ndOpticalInspection二光检查FOL–DieAttach芯片粘接FOL–DieAttach芯片粘接FOL–DieAttach芯片粘接FOL–EpoxyCure银浆固化FOL–WireBonding引线焊接FOL–WireBonding引线焊接FOL–WireBonding引线焊接FOL–WireBonding引线焊接FOL–WireBonding引线焊接FOL–3rdOpticalInspection三光检查EOL–EndofLine后段工艺EOL–Molding（注塑）EOL–Molding（注塑）EOL–Molding（注塑）EOL–LaserMark（激光打字）EOL–PostMoldCure（模后固化）EOL–De-flash（去溢料）EOL–Plating（电镀）EOL–PostAnnealingBake（电镀退火）EOL–Trim&Form（切筋成型）EOL–Trim&Form（切筋成型）EOL–FinalVisualInspection（第四道光检）400-680-9696
www.imart360.com