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板级光互连模块BGA焊点温振耦合应力应变有限元分析.docx

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板级光互连模块BGA焊点温振耦合应力应变有限元分析 Abstract TheBoard-LevelOpticalInterconnect(BLOI)moduleisacrucialcomponentinhigh-speedelectronicsystemsthatrequirehighdatatransmissionrates.However,thethermalandmechanicalstressgeneratedduringoperationcanaffectthereliabilityofthemodule.Inthispaper,wepresentafiniteelementanalysis(FEA)ofthethermalandmechanicalstress,strainanddisplacementresultingfromtheBGAsolderjointduringoperationusingtheANSYSsoftware.OursimulationsprovidedvaluableinsightsintothebehavioroftheBLOImoduleduringoperationandhelpfulintheoptimizationofitsdesign. Introduction Theboard-levelopticalinterconnect(BLOI)modulehasemergedasacriticalcomponentinhigh-performancecomputingsystemsthatrequirehighdatatransmissionratesbetweenelectroniccomponents.TheBLOImoduleusesopticalfiberstotransmitdata,whichofferhighbandwidthandhighdatatransmissionrateswhileminimizingelectromagneticinterference.Besides,BLOImoduleshavetheadvantageofbeingmoreimmunetothermalandmechanicalstressthanelectricalinterconnects. However,theBLOImodule'sthermalandmechanicalstresscanaffectitsreliability,especiallyasthedemandforhigheroperatingspeedsandincreaseddatathroughputcontinuestoincrease.Therefore,itisnecessarytoconductacomprehensiveanalysisofthethermal,mechanicalandelectromagneticpropertiesofBLOImodules. Inthispaper,wepresentafiniteelementanalysis(FEA)ofthethermalandmechanicalstressgeneratedinBGAsolderjointsinBLOImodules.Ourstudyaimedtoevaluatetheperformanceofthemoduleunderdifferentoperatingconditionsandimprovethereliability,robustness,andlongevityofBLOImodules. Modelingandsimulation OurFEAsimulationwascarriedoutusingtheANSYSsoftwareandfocusedonthethermalandmechanicalpropertiesoftheBGAsolderjointsintheBLOImodule.WesimulatedaBLOImoduleusinga3Dmodelandsubjectedittothermalandmechanicalloadstodeterminethestresses,strains,anddisplacementsthatdevelopedduringoperation.Weusedthefollowingmaterialpropertiesforoursimulation: -Young'smodulusE=130GPa -Poisson'sratioν=0.3 -Thermalcoefficientofexpansionα=17.3ppm/°C -Thermalconductivity