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CMOS/SOI的高温特性分析 CMOS/SOI(ComplementaryMetal-Oxide-Semiconductor/Silicon-On-Insulator)technologyhasgainedsignificantattentioninrecentyearsduetoitsuniquehigh-temperaturecharacteristics.Thispaperaimstoanalyzethehigh-temperaturepropertiesofCMOS/SOItechnology,focusingonitsthermalstability,leakagecurrent,andoverallperformance. Thermalstabilityisacrucialfactorinanyelectronicdevice,especiallyforhigh-temperatureapplications.CMOS/SOItechnologyoffersexcellentthermalstabilityduetothepresenceoftheburiedoxidelayer,whichactsasathermalinsulator.Thispreventsheatfromspreadingtoothercomponents,minimizingthermalcrosstalkandensuringreliableoperationevenatelevatedtemperatures. Furthermore,theuseofSOIsubstratesreducestheparasiticcapacitanceandimprovestheoverallspeedofCMOSdevices.Thisisparticularlybeneficialforhigh-temperatureapplicationswherethedevicesaresubjectedtoincreasedthermalstress.Thereducedparasiticcapacitanceallowsforfasterswitchingtimesandimprovedperformanceatelevatedtemperatures. Inadditiontothermalstability,theanalysisofleakagecurrentiscrucialforhigh-temperatureCMOS/SOIcircuits.Leakagecurrentistheundesiredflowofcurrentthroughtheinsulatinglayersortransistorchannelswhentheyareinanoff-state.Hightemperaturescanleadtoincreasedleakagecurrent,whichcanresultinpowerdissipationandreducedoverallefficiency. However,CMOS/SOItechnologyexhibitslowerleakagecurrentcomparedtotraditionalbulkCMOStechnology.Thisisprimarilyduetothesuppressionoftheback-gateeffectandthereducedparasiticcapacitanceofSOIdevices.Thepresenceoftheburiedoxidelayerpreventscarriersfromreachingthesubstrate,minimizingleakagecurrentsevenathightemperatures. Moreover,thereducedjunctioncapacitanceinCMOS/SOIdevicesreducestheimpactoftemperature-inducedvariationsinthresholdvoltageandsub-thresholdslope.Thisimprovestheoveralldeviceperformanceandenablesprecisecontroloverthetransistoroperation,evenatelevatedtemperatures. Oneofthecriticalparametersforanalyzingthehigh-temperaturecharacteristicsofCMOS/SOItechnologyisthemaximumoperatingtemper