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Cu-P基非晶态钎料基础性研究 Title:FundamentalResearchofCu-PAmorphousBrazingFillerMaterial Abstract: Cu-Pamorphousbrazingfillermaterialshavegainedsignificantattentionduetotheirexcellentsolderingpropertiesandwiderangeofapplications.ThisstudyaimstoinvestigatethefundamentalaspectsofCu-Pamorphousbrazingfillermaterials,includingtheircomposition,properties,processingtechniques,andpotentialapplications.TheresearchwillprovidevaluableinsightsintothedevelopmentandadvancementofCu-Pamorphousbrazingfillermaterialsinthefieldofsoldering. Introduction: Brazingisawidelyusedjoiningtechniqueforvariousmaterialsinindustriessuchasautomotive,electronics,andaerospace.Thechoiceofbrazingfillermaterialplaysacrucialroleindeterminingthequalityandreliabilityofbrazedjoints.Cu-Pamorphousbrazingfillermaterialshaveemergedaspromisingalternativesduetotheiruniqueproperties,suchaslowmeltingpoint,excellentwettingability,andhighstrength. CompositionofCu-PAmorphousBrazingFillers: Cu-Pamorphousbrazingfillermaterialsareprimarilycomposedofcopper(Cu)andphosphorus(P).Phosphorusisaddedtocoppertoformanamorphousstructure,whichimpartsdesirablepropertiestothebrazingfillermaterial.ThecompositionofCu-Pamorphousbrazingfillermaterials,especiallythephosphoruscontent,significantlyaffectstheirperformanceandcharacteristics. PropertiesofCu-PAmorphousBrazingFillers: Cu-Pamorphousbrazingfillermaterialsexhibitsuperiorsolderability,thermalstability,andmechanicalproperties.Theirlowmeltingpoint,typicallybelow800°C,enablesbrazingwithoutcausingstructuraldamagetothebasematerials.Theamorphousstructureofthesefillersensuresexcellentwettingandspreadingonthebasematerials,resultinginstrongandreliablejoints.Additionally,theypossesshighstrength,corrosionresistance,andelectricalconductivity,makingthemsuitableforawiderangeofapplications. ProcessingTechniquesforCu-PAmorphousBrazingFillers: VariousprocessingtechniquescanbeemployedtofabricateCu-Pamorphousbrazingfillermaterials,includingrapidsolidification,meltspinning,andmechanicalalloying.Rapidsolidification