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聚合物微流控芯片超声波键合方法研究.docx

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聚合物微流控芯片超声波键合方法研究 摘要： 本文研究了聚合物微流控芯片超声波键合方法，通过对比传统的热压键合方法和超声波键合方法的优缺点，分析了超声波键合技术的原理及其在聚合物微流控芯片上的应用。实验结果表明，聚合物微流控芯片超声波键合方法具有高效、快速和高精度的特点，比传统的热压键合方法更加适用于微流控芯片中细小结构的键合。 关键词：聚合物微流控芯片，超声波键合，热压键合，微流控芯片结构 Introduction: Microfluidictechnologyhasbeenwidelyusedinlifescienceresearch,medicaldiagnosisanddrugdiscoveryinrecentyears,duetoitshighefficiency,lowcost,andprecisecontroloffluidicvolumeandflowrate.Microfluidicdevicesareusuallycomposedofpolymersubstrates,suchaspolycarbonate,polydimethylsiloxane(PDMS),andcyclicolefincopolymer(COC),withcomplexmicrochannels,valvesandothersmallstructures.Fabricationandassemblyofmicrofluidicdevicesplaycriticalrolesindeterminingtheperformanceandreliabilityofmicrofluidicchips.Oneofthemostimportantstepsinmicrofluidicdeviceassemblyisthebondingofpolymersubstrates,whichcandirectlyaffectthechannelleakage,fluidicuniformity,anddevicelifespan. Traditionalbondingmethodsincludethermalbonding,solventbonding,andadhesivebonding,whichrequirehightemperature,toxicsolvents,orspecialadhesivesandoftenresultinunevenbonding,bubbleformation,orchanneldeformation.Recently,ultrasonicbondinghasemergedasapromisingalternativeforbondingofmicrofluidicdevices,asitcangeneratelocalizedandcontrolledmeltingofpolymersubstrateswithinsecondswithoutdamagingthemicrostructureofthedevice.Ultrasonicbondingutilizeshighfrequency(>20kHz)mechanicalvibrationstoinducefrictionalheatbetweenthepolymersubstrates,whichresultsinmeltingofthepolymerintheinterfacialregionandbondingofthetwosubstrateswithhighstrengthandreliability. Inthisstudy,weinvestigatetheultrasonicbondingmethodforbondingofpolymersubstratesinmicrofluidicdevices,especiallyforbondingofsmallandintricatestructures.Wecomparetheultrasonicbondingmethodwiththetraditionalthermalbondingmethodintermsofthebondingstrength,bondingtime,andbondinguniformity.Wealsostudytheeffectsofultrasonicpower,bondingtime,pressure,andfrequencyonthebondingquality. Experimental: Themicrofluidicdevicesusedinthisstudywerefabricatedbyconventionalsoft-lithographytechniquew