水曲柳单板化学镀铜制备电磁屏蔽复合材料的研究.pdf

65材料工程/2008年4期

水曲柳单板化学镀铜制备电磁屏蔽复合材料的研究
StudyonPreparationofElectromagneticShieldingCompositeby
ElectrolessCopperPlatingonFraxinusMandshuricaVeneer

王立娟,李坚,刘一星
(东北林业大学生物质材料科学与技术教育部重点试验室,哈尔滨150040)
WANGLi2juan,LIJian,LIUYi2xing
(KeyLaboratoryofBio2BasedMaterialScienceandTechnology
MinistryofEducation,NortheastForestryUniversity,Harbin150040,China)

摘要:以次亚磷酸钠为还原剂,在水曲柳单板表面化学镀铜制备电磁屏蔽复合材料。研究了镀液温度和pH值对镀层成
分及电性能的影响。分别采用扫描电镜(SEM)、能谱(EDAX)和X射线衍射(XRD)分析化学镀铜单板的表面形貌、镀层
成分和晶体结构。用低电阻测定仪和频谱仪分别测定了复合材料的表面电阻及电磁屏蔽效能。实验结果表明,镀铜单
板依然保持木材的孔隙结构,但表面已完全被镀层所覆盖。施镀过程中,温度和pH值对镀层成分、表面性貌及电性能
均有一定的影响。过高或过低的温度和pH值对Cu的沉积均是不利的。温度和pH值分别控制在70℃和918左右制

得的镀铜水曲柳单板的表面电阻率较低,电磁屏蔽效能较高,镀层铜为单质铜,夹杂少量Ni,P,Cu2O,排列相对紧密。横
纹和顺纹的表面电阻率分别为01139Ω/cm2和01111Ω/cm2,在频率为10kHz～115GHz范围内,电磁屏蔽效能约55～
60dB。
关键词:水曲柳单板;化学镀铜;表面电阻率;电磁屏蔽;复合材料
中图分类号:TS61文献标识码:A文章编号:100124381(2008)0420056205

Abstract:Electromagneticshieldingcompositewaspreparedbyelectrolesscopperplatingusinghypo2
phosphiteasreducingagent.EffectoftemperatureandpHvalueofplatingsolutiononcomposition
andelectricalperformanceofcoatingswereinvestigated.Surfacemorphologyofelectrolessplatedve2
neersandthecompositionofthecoppercoatingwereobservedanddeterminedbyscanningelectronic
microscope(SEM)andenergydispersiveX2rayanalysis(EDAX).Crystalstructureofthecoatingwas
investigatedbyX2raydiffraction(XRD).Low2resistancemeasuringinstrumentandspectrumanalyzer
wereusedformeasuringsurfaceresistanceandelectromagneticshieldingeffectiveness(ESE).There2
sultsshowthatporousstructureofwooditselfstillexistsonplatedveneer,andthesurfaceofwood
veneeriscoveredbythecoatingentirely.ItisfoundthattemperatureandpHvaluehaveeffectson
composition,surfacemorphologyofthecoatingandelectricalperformanceofthecompositeinthe
courseofplating.ExcessivelyloworhightemperatureandpHvalueareadverseforcopperdeposi2
tion.ThesurfaceresistivityandESEofplatedveneerundertemperature70℃andpHvalue918are
lowerandhigher,respectively.Copperiselementarysubstancemixedasmallquantityofnickel,
phosphourandcuprousoxideinthecoatingwhichismore