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Equipment_Topography.ppt

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ModelingandSimulationTWGPacoLeon,IntelInternationalTWGMembers:ModelingandSimulationTWG:ScopeModelingandSimulationTWG:KeyMessagesDifficultChallenges:Highfrequencycircuitmodeling(>1GHz)DifficultChallenges:UnifiedPackage/die-levelmodelsDifficultChallenges:Modelingofultra-shallowjunctionsDifficultChallenges:Equipment/topographymodeling:Modelthinfilmandetchcontrolacrossdie/waferResolutionenhancementeffectsandmasksynthesis(e.g.,OPC,PSM)Predictiveresistmodels248vs193vs157evaluationandtradeoffsNext-generationlithosystemmodelsDifficultChallenges:ReliabilitymodelsforcircuitdesignandtechnologydevelopmentDifficultChallenges:Gatestackmodelingforultra-thindielectricsDifficultChallenges(beyond2005):Nano-scaledevicemodelingDifficultChallenges(beyond2005):AtomisticprocessmodelingTechnologyRequirements:CostReductionTechnologyRequirements:ProcessTCAD(Accuracy)TechnologyRequirements:FrontEndProcessModeling(Capabilities)TechnologyRequirements:DeviceSimulation(Accuracy)TechnologyRequirements:DeviceModeling(Capabilities)LongtermdevicemodelingFirstYearofICProductionPotentialSolutions:Circuitmodels:Transistor,DevicePotentialSolutions:ReliabilitymodelingPotentialSolutions:NewITWGRecommendations(2000)SummaryModelingandSimulationDifficultChallenges